10 1 THD7896 VERSION 8 0 C YYYYMMDD THD7896 VERSION 20200110 Beta 20 1 THD7896 FORM 45 0 C FORMULATION CODE 30 1 THD7896 SPONID 20 0 C GMTDC ASSIGNED SPONSOR ID 40 1 THD7896 SPONCODE 10 0 C SPONSOR FORMULATION CODE 50 1 THD7896 MOD 2 0 C FORMULATION MODIFICATION 60 1 THD7896 BLEND 3 0 Z FORMULATION BLEND COUNTER 70 1 THD7896 COUNT 3 0 Z FORMULATION TESTED COUNTER 80 1 THD7896 METHOD 8 0 C DEXRON MANUAL METHOD CODE 90 1 THD7896 LAB 2 0 C TEST LAB 100 1 THD7896 INST 5 0 C TEST CELL 110 1 THD7896 CANDPCT 4 0 N % PERCENTAGE OF CANDIDATE SAMPLE IN BLEND 120 1 THD7896 BLNDPCT 4 0 N % PERCENTAGE OF OTHER SAMPLE IN BLEND 130 1 THD7896 OTHERID 60 0 C ID OF OTHER PRODUCT USED FOR BLENDED SAMPLE 140 1 THD7896 TESTSPON 40 0 C CONDUCTED FOR SPONSOR 150 1 THD7896 SPONINHS 40 0 C SPONSOR IN-HOUSE NUMBER 160 1 THD7896 LABINHS 30 0 C LAB IN-HOUSE NUMBER 170 1 THD7896 ALTCODE1 15 0 C ALTERNATE CODE 180 1 THD7896 TESTNUM 30 0 C TEST NUMBER 190 1 THD7896 RUN 8 0 C RUN NUMBER 200 1 THD7896 DTSTRT 8 0 C YYYYMMDD START DATE 210 1 THD7896 STRTTIME 5 0 C HH:MM START TIME 220 1 THD7896 DTCOMP 8 0 C YYYYMMDD COMPLETED DATE 230 1 THD7896 EOTTIME 5 0 C HH:MM COMPLETED TIME 240 1 THD7896 VALIDOP 3 0 C YES or NO VALIDITY STATEMENT 250 1 THD7896 SUBLAB 40 0 C SUBMITTED BY: TESTING LABORATORY 260 1 THD7896 SUBSIGIM 70 0 C SUBMITTED BY: SIGNATURE IMAGE 270 1 THD7896 SUBNAME 40 0 C SUBMITTED BY: SIGNATURE TYPED NAME 280 1 THD7896 SUBTITLE 40 0 C SUBMITTED BY: TITLE 290 2 THD7896 NATC40 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @40°C 300 2 THD7896 UATC40 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @40°C 310 2 THD7896 NATC70 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @70°C 320 2 THD7896 UATC70 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @70°C 330 2 THD7896 NATC100 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @100°C 340 2 THD7896 UATC100 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @100°C 350 2 THD7896 NATC130 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @130°C 360 2 THD7896 UATC130 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @130°C 370 2 THD7896 NATC170 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @170°C 380 2 THD7896 UATC170 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @170°C 390 2 THD7896 UFLCOND 10 0 C DKA USED FLUID CONDITIONING (DKA) 400 2 THD7896 NMDTSTRT 8 0 C YYYYMMDD NEW FLUID MEASUREMENT START DATE 410 2 THD7896 UMDTSTRT 8 0 C YYYYMMDD USED FLUID MEASUREMENT START DATE 420 2 THD7896 NMSTIME 5 0 C HH:MM NEW FLUID MEASUREMENT START TIME 430 2 THD7896 UMSTIME 5 0 C HH:MM USED FLUID MEASUREMENT START TIME 440 2 THD7896 NMDTEOT 8 0 C YYYYMMDD NEW FLUID MEASUREMENT EOT DATE 450 2 THD7896 UMDTEOT 8 0 C YYYYMMDD USED FLUID MEASUREMENT EOT DATE 460 2 THD7896 NMETIME 5 0 C HH:MM NEW FLUID MEASUREMENT EOT TIME 470 2 THD7896 UMETIME 5 0 C HH:MM USED FLUID MEASUREMENT EOT TIME 480 2 THD7896 OCOMRxxx 60 0 C COMMENT LINE XXX