11 1 THD7896 VERSION 8 0 C YYYYMMDD THD7896 VERSION 20191213 21 1 THD7896 FORM 45 0 C FORMULATION CODE 31 1 THD7896 SPONID 20 0 C GMTDC ASSIGNED SPONSOR ID 41 1 THD7896 SPONCODE 10 0 C SPONSOR FORMULATION CODE 51 1 THD7896 MOD 2 0 C FORMULATION MODIFICATION 61 1 THD7896 BLEND 3 0 Z FORMULATION BLEND COUNTER 71 1 THD7896 COUNT 3 0 Z FORMULATION TESTED COUNTER 81 1 THD7896 TESTTYPE 8 0 C TEST TYPE 91 1 THD7896 LAB 2 0 C TEST LAB 101 1 THD7896 INST 5 0 C TEST CELL 111 1 THD7896 CANDPCT 4 0 N % PERCENTAGE OF CANDIDATE SAMPLE IN BLEND 121 1 THD7896 BLNDPCT 4 0 N % PERCENTAGE OF OTHER SAMPLE IN BLEND 131 1 THD7896 OTHERID 60 0 C ID OF OTHER PRODUCT USED FOR BLENDED SAMPLE 141 1 THD7896 TESTSPON 40 0 C CONDUCTED FOR SPONSOR 151 1 THD7896 SPONINHS 40 0 C SPONSOR IN-HOUSE NUMBER 161 1 THD7896 LABINHS 30 0 C LAB IN-HOUSE NUMBER 171 1 THD7896 ALTCODE1 15 0 C ALTERNATE CODE 181 1 THD7896 TESTNUM 30 0 C TEST NUMBER 191 1 THD7896 RUN 8 0 C RUN NUMBER 201 1 THD7896 DTSTRT 8 0 C YYYYMMDD START DATE 211 1 THD7896 STRTTIME 5 0 C HH:MM START TIME 221 1 THD7896 DTCOMP 8 0 C YYYYMMDD COMPLETED DATE 231 1 THD7896 EOTTIME 5 0 C HH:MM COMPLETED TIME 241 1 THD7896 VALIDOP 3 0 C YES or NO VALIDITY STATEMENT 251 1 THD7896 SUBLAB 40 0 C SUBMITTED BY: TESTING LABORATORY 261 1 THD7896 SUBSIGIM 70 0 C SUBMITTED BY: SIGNATURE IMAGE 271 1 THD7896 SUBNAME 40 0 C SUBMITTED BY: SIGNATURE TYPED NAME 281 1 THD7896 SUBTITLE 40 0 C SUBMITTED BY: TITLE 291 2 THD7896 NATC40 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @40°C 301 2 THD7896 UATC40 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @40°C 311 2 THD7896 NATC70 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @70°C 321 2 THD7896 UATC70 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @70°C 331 2 THD7896 NATC100 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @100°C 341 2 THD7896 UATC100 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @100°C 351 2 THD7896 NATC130 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @130°C 361 2 THD7896 UATC130 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @130°C 371 2 THD7896 NATC170 8 5 N W/m-K NEW FLUID AVERAGE THERMAL CONDUCTIVITY @170°C 381 2 THD7896 UATC170 8 5 N W/m-K USED FLUID AVERAGE THERMAL CONDUCTIVITY @170°C 391 2 THD7896 UFLCOND 10 0 C DKA USED FLUID CONDITIONING (DKA) 401 2 THD7896 NMDTSTRT 8 0 C YYYYMMDD NEW FLUID MEASUREMENT START DATE 411 2 THD7896 UMDTSTRT 8 0 C YYYYMMDD USED FLUID MEASUREMENT START DATE 421 2 THD7896 NMSTIME 5 0 C HH:MM NEW FLUID MEASUREMENT START TIME 431 2 THD7896 UMSTIME 5 0 C HH:MM USED FLUID MEASUREMENT START TIME 441 2 THD7896 NMDTEOT 8 0 C YYYYMMDD NEW FLUID MEASUREMENT EOT DATE 451 2 THD7896 UMDTEOT 8 0 C YYYYMMDD USED FLUID MEASUREMENT EOT DATE 461 2 THD7896 NMETIME 5 0 C HH:MM NEW FLUID MEASUREMENT EOT TIME 471 2 THD7896 UMETIME 5 0 C HH:MM USED FLUID MEASUREMENT EOT TIME 481 2 THD7896 OCOMRxxx 60 0 C COMMENT LINE XXX 491 9999 THD7896 TESTKEY 38 0 C TESTKEY